pb rohs e2upas-30.000m tr e2u p a s -30.000m tr series rohs compliant (pb-free) resistance welded hc-49/us crystal frequency tolerance/stability 10ppm at 25c, 15ppm over -20c to +70c mode of operation at-cut fundamental packaging options tape & reel nominal frequency 30.000mhz load capacitance series resonant electrical specifications nominal frequency 30.000mhz frequency tolerance/stability 10ppm at 25c, 15ppm over -20c to +70c aging at 25c 5ppm/year maximum load capacitance series resonant shunt capacitance (c0) 7pf maximum equivalent series resistance 40 ohms maximum mode of operation at-cut fundamental drive level 1mwatt maximum storage temperature range -40c to +125c insulation resistance 500 megaohms minimum at 100vdc environmental & mechanical specifications fine leak test mil-std-883, method 1014 condition a gross leak test mil-std-883, method 1014 condition c lead integrity mil-std-883, method 2004 lead termination sn 2m - 6m mechanical shock mil-std-202, method 213 condition c resistance to soldering heat mil-std-202, method 210 resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010 vibration mil-std-883, method 2007 condition a mechanical dimensions (all dimensions in millimeters) line marking 1 e30.000m e=ecliptek designator m=mhz www.ecliptek.com | specification subject to change without notice | rev e 8/12/2010 | page 1 of 4 6.35 min 3.68 max 4.88 0.20 dia 0.457 0.051(x2) 4.70 max 11.18 max
quantity per reel: 1,000 pieces tape & reel dimensions *compliant to eia 468b 3.81 0.7 12.7 0.3 0.9 max 18.0 +1.0/-0.5 dia 81.5 max 14.0 min 38.0 max dia 178 min 370 max 56.0 max e2upas-30.000m tr 32.2 max 18.0 2.0 www.ecliptek.com | specification subject to change without notice | rev e 8/12/2010 | page 2 of 4
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods e2upas-30.000m tr high temperature solder bath (wave solder) ts max to tl (ramp-up rate) 3c/second maximum preheat - temperature minimum (ts min) 150c - temperature typical (ts typ) 175c - temperature maximum (ts max) 200c - time (ts min) 60 - 180 seconds ramp-up rate (tl to tp) 3c/second maximum time maintained above: - temperature (tl) 217c - time (tl) 60 - 150 seconds peak temperature (tp) 260c maximum for 10 seconds maximum target peak temperature (tp target) 250c +0/-5c time within 5c of actual peak (tp) 20 - 40 seconds ramp-down rate 6c/second maximum time 25c to peak temperature (t) 8 minutes maximum moisture sensitivity level level 1 www.ecliptek.com | specification subject to change without notice | rev e 8/12/2010 | page 3 of 4
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods e2upas-30.000m tr low temperature solder bath (wave solder) ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 30 - 60 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 245c maximum target peak temperature (tp target) 245c maximum 1 time / 235c maximum 2 times time within 5c of actual peak (tp) 5 seconds maximum 1 time / 15 seconds maximum 2 times ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 low temperature manual soldering 185c maximum for 10 seconds maximum, 2 times maximum. high temperature manual soldering 260c maximum for 5 seconds maximum, 2 times maximum. www.ecliptek.com | specification subject to change without notice | rev e 8/12/2010 | page 4 of 4
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